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JEM Succeeds in the Gang Mounting of Microscopic Balls on the 12-inch Wafer
The Semiconductor Industry News - December, 2001
JEM Develops the Microscopic Bump Placement System for Next Generation Version LSIs
The Electronics Mount Technology - December, 2001
Microscopic Bump Placement System for Next Generation Version LSIs
New Technology Japan- June, 2001
NEC and Japan E.M. Develops a Microscopic Bump Placement System for Fine Pitches
The Daily Industry News - March, 2001
